The 'round table' style discussion format will facilitate audience involvement, discussion, questions and answers and specific problem solving along with education on the possible solutions available to designers today. Be sure to invite your fellow Mechanical and Electrical Engineers to attend as well. The thermal questions and solutions will be of particular interest to them too! "

Dr. Sandy Kumar is the Director of Technology at American Standard Circuits, Franklin Park, IL. He has spent the last 25 years in advanced materials processing technologies related to semiconductor devices, printed circuits, ceramic composites including nano-materials, solar energy conversion, and conducting polymers. He is a certified six-sigma black belt and holds a Ph.D. in materials science from Indian Institute of Technology (IIT) New Delhi.

Dr. Kumar has recently developed and patented a thermally conducting bonding adhesive called Thermasil. He is currently working on providing thermal management solutions in printed circuits used for RF devices, electronic power supplies, automotive parts and any heat generating electronic components that require efficient cooling.

At American Standard Circuits, Dr. Kumar is managing R&D activities on thermal management in PCBs, fine line mill-and-fill circuits, embedded passives, and rigid-flex circuits, using various dielectrics like PTFE composites, FR4, polyimide and lead free laminates. He has published over 50 research and technical papers related to various materials issues in thin film devices.

Before joining American Standard Circuits, he was a senior process engineer at Honeywell Electronic Materials (ASTI), Costa Mesa, CA and as R&D manager at Filtran Microcircuits, Ottawa, Canada. From 1985 to 1990, he worked in France as a research associate and then associate professor of materials science (semiconductor materials) at the National Institute of Applied Sciences (INSA) in Lyons.

He can be reached at skumar@asc-i.com
 

About American Standard Circuits:

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ASC manufactures quality printed circuit boards on various types of substrates for a variety of applications. These products can go in high speed computing, high frequency telecommunication ranging from aerospace to deep space, defense, LEDs and other heat sink automotive electronics, and navigation devices – right from small test and prototype quantities to large volume production. More...