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SDDC Minutes August 20, 2002

 | Meeting Minutes for SDDC General Meeting of August 20, 2002 |
Location -
Overland
Storage, Inc.,
4820
Overland Avenue, San Diego, CA 92123
Tel: (858)
571-5555
Time 6:00PM
Core group members attending:
Leslie Gomez, President
Bill Brooks, Web/Communications Officer
Bill Gebhardt, Treasurer
Elena Morse, Education Officer
Attending – Mark Thompson, Paul Fleming, Chris Lyle, Joe Cortez, Tom
Hausherr, Mumtaz Bora, Scott McCurdy, Doug Willits, Gareth Parry,
David Farley, Jo Cribben, Julie Laverdiere, Shaun Salas, Michael Tex,
Donna Perry, Brian Cyr, Mitch Morey, Frank Rose, Sean Rundgren, Bruce
Summit, D.R. Auten, Steve Toothacre, Jess Conner, Heidi McCullough,
Jon Martinez, Barb Carter, Sharon Barclay, Carmine Kennedy and Don
Carron.
Meeting Agenda-
6:00PM Island Bros. Teriyaki Chicken/Beef dinner complements of
Coretec, Drinks and meeting room provided by Overland Storage.
6:30PM Meeting call to order - New business, announcements
6:45PM Gareth Parry, of Coretec HDI, Advanced Interconnection
8:30PM Meeting adjourned
A power point
presentation of Gareth Parry's discussion on HGI, Advanced
Interconnection is
available from Scott McCurdy of Coretec. To obtain a copy
contact Scott at
smccurdy@si-group.biz or Phone him at (714)425-3235.
Gareth
Parry, BSc., P.Eng., F.A.E. Co-Director of Field
Application Engineering at Coretec. Gareth is a Professional
Engineer with a Bachelor of Science in Mechanical Engineering.
He has over 20 years experience in the printed circuit industry. |
Bill Brooks announced
the council's decision to establish a scholarship program to promote
student's who wish to take PCB design related courses through the
college system. He solicited ideas for fund raising and guidelines for
the awards to be made on academic achievement.
Leslie Gomez
introduced our guest speaker and the members of Coretec who were in
attendance.
Gareth Parry spoke for
an hour on the subject of HDI and Microvias, routing strategies, costs
related to processes using imaged or laser ablated holes in
constructing via features in PCBs. He also mentioned the use of silver
epoxy in standard vias to create filled via in pad technology. He
spoke about the technology edge for trace and space features and
mentioned thermal as it relates to the Tg and Z axis expansion issues
related to filled vias.
Many layer
illustrations and via construction details were covered. All in
attendance were very interested in the subject matter and many took
notes.
We want to thank
Overland Storage for letting us use their fine facilities to hold our
meetings and for providing the drinks for our member visitors and
guests.
Thanks to all who attended for a great
meeting. Your involvement and support makes the San Diego Chapter a
valuable asset to the San Diego PCB Design community. We look forward
to seeing all of you at our next meeting!
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